Sputtering Systems

DC Magnetron Sputtering Systems

A wide range of budgetary DC sputtering magnetrons - balanced and unbalanced, linear with the length up to 1600 mm and more on demand, circular, triangle (Delta), single and dual. Magnetrons are intended for R&D, lab, and mass production deposition of metals and their compounds (nitrides, oxides) on metal, plastic, ceramic, glass and roll substrates (see Coating Machines Section).

Our magnetrons may be produced for flange and inside a chamber installation, with direct or indirect target water cooling. We can supply magnetrons meeting your custom target dimensions. We provide also magnetron power supplies and ion sources for ion beam assisted deposition matched with ordered magnetrons (see Ion Sources Section).

There are some typical specifications below:

Linear DC magnetron MS1500 Magnetron MSDelta 400
Target dimensions, mm 1460x120x8 Magnetron overall dimensions, mm 385x385x385x106
Maximal magnetic field, mT up to 100 Maximal magnetic field, mT up to 100
Target utilization, % 40 Target utilization, % 40
Target cooling Water, direct Target cooling Direct or indirect
Maximal power density on the target, W/cm2 Up to 20 Maximal power density on the target, W/cm2 Up to 20
Magnetic system Permanrnt magnets Magnetic system Permanent magnets
Working pressure, Pa 6x10-2 ... 8x10-1 Working pressure, Pa 6x10-2 ... 8x10-1
Coating thickness uniformity, % 5 Coating thickness uniformity, % 51
Maximal target thickness, mm 10

1) - for substrates loaded on rotating fixture Dia.700 mm.

Magnetron power supply MPS8000
Type MF, IGPT, voltage/current stabilizer
Output current, A 0 ... 15
Output voltage, V up to 700
Output voltage frequency, kHz 40 ... 60
Output voltage impulse shape Meander
Open circuit voltage, V 1000
Power, kW, no more than 8
Efficiency, % 90
Overall dimensions, mm 470x470x200
Weight, kg 18

Ion Beam Sputtering Systems

This patented ion beam sputtering system includes ring ion source and rotatable water-cooled three targets holder. It allows deposit multi-layers structures in the same run. The similar second ring ion source with opposite beam direction may be used for substrate treatment.

Ion sources are produced for targets Ø10, 30, 50, 100, 150, and 200 mm

Target diameter, mm
10 30 50 100 150 200
Discharge voltage, kV 2 ... 4
Target ion current, mA 30 60 120 180 250 350
Ion source overall dimensions, mm 100x40 100x40 130x40 170x40 220x40 300x40
Number of targets 3
Coating uniformity, % 5
SiO2 deposition rate, nm/s1 1
Cu deposition rate, nm/s1 5

1) - 80 mm distance between target and substrate.

Miniature circular ion sources (beam ouput diameter 20 mm) are developed for some applications like rare metals sputtering, ion beam milling, etc.

Ion beam sputtering system consisting of two independed linear anodic layer ion sources, two water cooled rotating target holders with target charge neutralization allows deposit complicated multi-layer and composite coatings onto substrates located on rotating drum.
Discharge voltage, kV 3 ... 7
Target ion current, A 1 ... 2
Gas pressure, Pa 4x10-2 ... 8x10-2
System overall dimensions, mm 808x150x500
SiO2 deposition rate, nm/s1 1
Cu deposition rate, nm/s1 5

1) - 120 mm distance between target and substrate.


We are sorry, this page is still under construction! Please visit us later to see more sputtering systems. If you need more detailed information or looking for some special sputtering magnetrons or ion sources, please contact us directly. Thanks for your patience!

VECOR 101 Duranzo Aisle, Irvine, CA92606, USA
Phone: +1-949-394-4466, Fax: +1-949-451-6813, info@vecorus.com